Single axis manipulator with controlled compliance

#This invention relates generally to manufacture of semiconductor devices and more particularly to mechanical systems that position testers relative to a material handling unit in an automatic test system.

#In the manufacture of semiconductor devices, the semiconductor devices are usually tested at least once during the manufacturing operation. Further processing is done on the devices based on the results of the tests. The testing might be used to separate properly operating devices from devices that fail to operate properly. However, testing can also be used to feed back data to other stages in the manufacturing operation to make adjustments that increase the yield of properly operating devices. In other instances, the test results are used to sort devices into performance categories. For example, a device might operate at data rates of 200 MHz, but not operate at data rates of 400 MHz. Following testing, the device might be classified as a 200 MHz device and sold at a lower price than a 400 MHz device.

#A testing stage might also be used to make physical changes to the device under test. Many semiconductor devices with memories contain redundant elements. If defective memory cells are discovered during testing, the semiconductor device might be sent to a repair station, such as a laser repair station, where connections on the device are rearranged to disconnect the faulty cells and connect redundant elements in their places.

#The invention will be better understood by reference to the following more detailed description and accompanying drawings in which

#FIG. 1A is a sketch illustrating a material handling unit;

#FIG. 1B is a sketch illustrating a work cell with a tester separated from the material handling unit;

#The present invention is, in its preferred embodiment, used in connection with a material handling unit for packaged parts testing. Therefore, the description of the preferred embodiment that follows uses a packaged part handler as an example.

#FIG. 1A shows such a handler 100. Handler 100 includes an interface area 110 where a complementary interface area on a tester (150, FIG. 1B) will interface to the handler. Generally, the handler includes a device interface board (DIB) 112. On one side, DIB 106 contains numerous contactors which make electrical connection to the devices being tested. The contactors connect to conducting pads on the exposed side of DIB 106. Spring pins (not shown) in the interface area of the tester make contact to these pads, creating signal paths from the tester 150 to the devices being tested. However, for the system to work reliably, the tester and the handler must be aligned.

#Interface area 110 includes a plurality of interface modules 114. Three modules are preferred for more accurate alignment. In the preferred embodiment, interface modules 114 are kinematic interface modules as described in the above mentioned U.S. Pat. No. 5,982,182, which is incorporated by reference.