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US 2003/0192866 A1Published application
Chip scale marker and making method
AssigneeEo Technics Co., Ltd.
InventorYou-Hie Han
Life of this patent
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AssigneeEo Technics Co., Ltd.
InventorYou-Hie Han
Estimating the term…
Provided is a chip scale marker and a marking method. The method for marking, using a chip scale marker, wherein a laser beam is irradiated from a laser source on the wafer chips via a galvano scanner and an f-theta lens, the method comprising: (a) measuring position information of a plurality of points on the wafer; (b) transmitting the measured position information to a controller; (c) calculating a deviation between a marking distance between the f-theta lens and the point on the wafer surface and a focus distance of the f-theta lens from the transmitted position information; and (d) if the deviation is greater than a predetermined value in the step (c), calibrating the wafer chip to be positioned at the focus distance of the f-theta lens. According to the chip scale marker, it is possible to increase marking quality by measuring and calibrating a vertical distance from an f-theta lens of the laser system to each wafer chip so that the wafer chip is marked at a predetermined distance from the f-theta lens of the laser system.
A method for marking, using a chip scale marker, wherein a laser beam is irradiated from a laser source on the wafer chips via a galvano scanner and an f-theta lens, the method comprising:
A chip scale marker that includes a laser system for marking a wafer, a wafer holder for supporting a wafer to be processed, and a camera which moves while being connected to an X-Y stage over the wafer holder and monitors an object held by the wafer holder, the chip scale marker further comprising:
A chip scale marker that includes a laser system for marking a wafer, a wafer holder for supporting a wafer to be processed and a camera which moves while being connected to an X-Y stage over the wafer holder, and monitors an object held by the wafer holder, the chip scale marker further comprising:
A chip scale marker that includes a laser system for marking a wafer by irradiating a laser beam from a laser oscillator via a galvano scanner and an f-theta lens on the wafer to be marked, a wafer holder for supporting a wafer to be marked and a camera which moves while being connected to an X-Y stage over the wafer holder and monitors an object held by the wafer holder, the chip scale marker further comprising:
Dependencies are inferred from the claim text.
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Apparatus for monitoring, sorting, marking, testing or measuring: marking devices
Marks applied to devices
Marks applied to devices, e.g. for alignment or identification: for use after dicing
Generic processes or apparatus for the manufacture or treatment of devices covered
Term end not estimated
1. Field of the Invention
The present invention relates to a chip scale marker and a marking method, and more particularly, to a method for marking characters on a wafer chip after calibrating a marking distance from a laser to the wafer, using a laser of a chip scale marker and a device thereof.
2. Description of the Related Art
The above objects and advantages of the present invention will become more apparent by describing in detail preferred embodiments thereof with reference to the attached drawings in which:
FIG. 1 is a schematic view of a general chip scale marker.
FIG. 2 is view showing a depth of focus of a laser beam to be irradiated on a wafer.
The present invention will now be described more fully with reference to the accompanying drawings in which preferred embodiments of the invention, a device for correcting a marking distance of a chip scale marker, are shown. In the drawings, the thickness of layers and regions are exaggerated for clarity.
FIG. 4 is a schematic view of a chip scale marker according to an embodiment of the present invention, and FIG. 5 is a view showing a schematic configuration of a laser system of FIG. 4.
Referring to FIGS. 4 and 5, a vertical moving device 180 and an X-Y stage 150 are placed on the table 160. The wafer holder 120 is connected to a side of the vertical moving device 180 in a horizontal direction. A wafer w is placed on the wafer holder 120 and a laser system 130 is positioned below the wafer holder 120. The laser system 130 includes a laser source 131 for providing a laser beam, and a focus distance correction lens 132, a galvano scanner 136, and an f-theta lens 137 sequentially placed on a laser path from the laser oscillator 131.