Clip for heat sink

#1. Field of the Invention

#The present invention relates to clips for heat sinks, and more particularly to a clip which firmly secures a heat sink to an integrated circuit (IC) chip.

#2. Description of Related Art

#FIG. 1 is an exploded view of a clip in accordance with a preferred embodiment of the present invention, and a heat sink;

#FIG. 2 is an assembled view of FIG. 1;

#FIG. 3 is a perspective view of the clip attaching the heat sink to an IC chip supported on a printed circuit board; and

#Reference will now be made to the drawing figures to describe embodiments of the present invention in detail.

#FIG. 1 shows a clip 30 in accordance with a preferred embodiment of the present invention, for securing a heat sink 10. Referring also to FIGS. 2-3, the heat sink 10 is mounted on an IC chip 50 that is supported on a printed circuit board (PCB) 70. The PCB 70 defines four through holes 72 therein. The through holes 72 surround the chip 50.

#The heat sink 10 comprises a base 12 for mounting on the chip 50, and a plurality of fins 14 extending from a top surface of the base 12. The fins 14 are arrayed in parallel rows. Thus, a plurality of parallel grooves 16 is defined in the heat sink 10, each groove 16 being disposed between corresponding rows of the fins 14. Each groove 16 has a substantially V-shaped profile. A centermost groove 16 is disposed between two adjacent inmost rows of the fins 14. Each fin 14 in the two adjacent inmost rows of the fins 14 outwardly forms a protrusion 18 on a side of the fin 14 that is opposite to a side of the fin 14 that is adjacent the centermost groove 16. All the protrusions 18 are disposed at a same height. Thus the protrusions 18 are arrayed in two parallel rows.