Loading patent…
AssigneeSamsung Electronics Co., Ltd.
InventorsIn-Jun Yeo, Byoung-Moon Yoon, Kyung-Hyun Kim, Sang-Rok Hah, Jeong-Lim Nam, Hyun-Ho Jo
Estimating the term…
The apparatus for cleaning a wafer includes an energy concentration relieving member positioned at the side of the wafer. An elongated portion of a probe extends over and substantially parallel to the wafer surface. A vibrator is attached to a rear end of the probe for vibrating the probe such that the elongated portion transfers acoustic vibrational energy to the wafer and dislodges debris.
An apparatus for cleaning a semiconductor wafer comprising:
A method of cleaning a semiconductor wafer comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Backward citations are indexed for grants only.
For wet cleaning or washing: using mainly spraying means, e.g. nozzles
With additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration: by sonic or ultrasonic…
Cleaning and liquid contact with solids: semiconductor wafer
Generic processes or apparatus for the manufacture or treatment of devices covered
Term end not estimated
This U.S. nonprovisional application claims priority under 35 U.S.C. §119 to Korean Patent Application No. 2002-20470 filed Apr. 15, 2002, the contents of which are incorporated by reference in its entirety.
1. Field of the Invention
The present invention relates to an apparatus and method for cleaning a wafer used in the manufacture of a semiconductor device.
Exemplary embodiments of the present invention will be readily understood with reference to the following detailed description thereof provided in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic plan view of an apparatus for cleaning a semiconductor wafer according to an exemplary embodiment of the present invention;
FIG. 2 is a schematic side view of an apparatus for cleaning a semiconductor wafer according to an exemplary embodiment of the present invention;
Exemplary embodiments of the present invention now will be described more fully below with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. The invention may, however, be embodied in many different forms and should not be construed as being limited to the exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concepts of the present invention to those skilled in the art. In the drawings, the thickness of layers and regions are exaggerated for clarity. Like reference numerals in different drawings refer to like elements. Also, when it is written that a component or layer is formed “on” another component or layer, the component or layer can be formed directly on the other component or layer, or other components or layers can intervene therebetween.
A general description of a cleaning apparatus for cleaning a semiconductor wafer according to an exemplary embodiment of the present invention will first be described in detail below. Next, a conventional cleaning apparatus will be described and then compared to a cleaning apparatus according to an exemplary embodiment of the present invention. An alternative cleaning apparatus for cleaning a semiconductor wafer according to an exemplary embodiment of the present invention will then be described in detail. Finally, a method of cleaning a semiconductor wafer according to an exemplary embodiment of the present invention will be described.
1. General Description of an Exemplary Embodiment of the Present Invention