High performance heat sink configurations for use in high density packaging applications

A heat dissipation system comprising:

• an integrated circuit device having a front side and a back side opposite the front side, wherein the front side is attached to a surface of a circuit board, the surface of the circuit board having components mounted thereon and projecting outwardly from the surface;
• and
• a heat dissipation device including
• a thermally conductive core having a base thremally coupled to the back side of the integrated circuit device, the core having an axis perpendicular to the base, and the core further having upper and lower outer surface areas concentric to the axis and having first and second lengths, respectively;
• a first array of radially extending fin structures, the first array being thermally coupled to the upper outer surface area along the first length, wherein the first array has a first outer diameter;
• and
• a second array of radially extending fin structures, the second array being thermally coupled to the lower outer surface area along the second length, wherein the second array has a second outer diameter, the second outer diameter being less than the first outer diameter, and wherein the second length and the second outer diameter are sized to provide sufficient space for the components around and in close proximity to the lower outer surface area and below the first array.