Etching multi-shaped openings in silicon
AssigneeApplied Materials, Inc.
InventorsAnisul Khan, Sharma V. Pamarthy, Sanjay Thekdi, Ajay Kumar
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Abstract
Openings of variable shape are made sequentially by alternately etching an opening in silicon and depositing a conformal fluorocarbon polymer on the sidewalls. This polymer protects the sidewalls of the opening from further etching. An isotropic etch can be carried out to change the profile of the etched feature, and for lift-off of the etched feature from the silicon substrate.
Claims10
A method of forming variably shaped features in a silicon substrate by alternately etching an opening and depositing a fluorocarbon polymer conformally on the sidewalls of the opening, so as to protect the sidewalls from further etching.
A method comprising carrying out alternate deposition and etch steps for time periods that determine the shape of an opening.
A method for forming a variably shaped opening comprising carrying out alternate deposition and etch steps using varying time periods to vary the profile of the opening and applying a bias to the substrate during the deposition step to prevent polymer deposition on the bottom of the opening.
Dependencies are inferred from the claim text.