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US 2003/0188686 A1Published application
Semiconductor manufacturing apparatus and manufacturing method for semiconductor device
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorTadashi Miyagi
Life of this patent
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Abstract
A level to detect a horizontal holding state of a wafer by a chuck is provided on a side surface portion of chuck supporting wafer. This device provides a semiconductor manufacturing apparatus allowing a uniform application of a prescribed liquid on the wafer in a manufacturing step of a semiconductor, and provides a semiconductor device thus manufactured.
Claims5
A semiconductor manufacturing apparatus, comprising:
- wafer holding means for holding a wafer in a horizontal state;
- liquid feeding means for feeding a prescribed liquid on a surface of said wafer;
- and
- horizontal holding state detection means for detecting a horizontal holding state of the wafer by said wafer holding means.
1 more element
A manufacturing method for semiconductor device manufactured by using a semiconductor manufacturing apparatus including
- wafer holding steps for holding a wafer in a horizontal state,
- liquid feeding steps for feeding a prescribed liquid on a surface of said wafer, and
- horizontal holding state detection steps for detecting a horizontal holding state of the wafer by said wafer holding means.
Dependencies are inferred from the claim text.