Electrical device
AssigneeSiemens Aktiengesellschaft
InventorsStefan Dorrhofer, Dietmar Schultz, Michael Nitzschke
Life of this patent
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Abstract
In the case of an electrical device with a circuit arranged on a support plate and with a leadframe, forming electrical leads, for the electrical connection of the circuit to further electrical components, it is provided that the support plate is in heat-conducting connection with at least a part of the leadframe. In this case, the leadframe may be formed at least partly with a flat surface area and the support plate may rest on the flat part. An electrical insulation between the support plate and the leadframe may be formed by a double-sided adhesive film or by a printed-on adhesive.
Claims8
An electrical device with a circuit arranged on a support plate and with a leadframe, forming electrical leads, for the electrical connection of the circuit to further electrical components, characterized in that the support plate (12) is in heat-conducting connection with at least a part (10) of the leadframe (7).
The device as claimed in one of the preceding claims, characterized in that the leadframe (7) is encapsulated in plastic (8), with electrical contact areas (9, 16) and areas (18) intended for heat-conducting connection with the support plate (12) being left free.
Dependencies are inferred from the claim text.