Apparatus and methods for enhancing thermal performance of integrated circuit packages

An apparatus for enhancing thermal uniformity across a semiconductor device, the apparatus comprising:

• the semiconductor device, the semiconductor device having a plurality of thermal regions, a first thermal region of the plurality of thermal regions having a different temperature than a second thermal region of the plurality of thermal regions;
• and
• a thermal enhancement material located substantially adjacent to the first and second thermal regions,
• wherein a thermal conductivity of the thermal enhancement material is adjusted in relation to a temperature effecting the thermal enhancement material.

An apparatus for enhancing thermal uniformity across a semiconductor device, the apparatus comprising:

• the semiconductor device, the semiconductor device having a plurality of thermal regions, a first thermal region of the plurality of thermal regions having a different temperature than a second thermal region of the plurality of thermal regions;
• and
• thermal enhancement means located substantially adjacent to the first and second thermal regions,
• wherein a thermal conductivity of the thermal enhancement material is adjusted in relation to a temperature effecting the thermal enhancement material.