Substrate treatment apparatus and substrate treatment method
AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsAkira Izumi, Hiromi Kiyose, Sachiko Noguchi
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Abstract
A substrate treatment apparatus comprising: a pretreatment section for bombarding liquid droplets against a surface of a substrate, the liquid droplets being generated by mixing a pretreatment liquid comprising ammonia and an oxidizing agent with a gas; and an etching liquid supplying section for supplying an etching liquid onto the substrate surface. The oxidizing agent is, for example, hydrogen peroxide. The pretreatment section may comprise a bi-fluid nozzle which generates the droplets of the pretreatment liquid and ejects the liquid droplets onto the substrate surface.
Claims17
A substrate treatment apparatus comprising:
- a pretreatment section for bombarding liquid droplets against a surface of a substrate, the liquid droplets being generated by mixing a pretreatment liquid comprising ammonia and an oxidizing agent with a gas;
- and
- an etching liquid supplying section for supplying an etching liquid onto the substrate surface.
A substrate treatment method comprising the steps of:
- bombarding liquid droplets onto a surface of a substrate for pretreatment of the substrate surface, the liquid droplets being generated by mixing a pretreatment liquid comprising ammonia and an oxidizing agent with a gas;
- and
- supplying an etching liquid onto the substrate surface after the pretreatment.
Dependencies are inferred from the claim text.