Heat treatment apparatus and a method for fabricating substrates
AssigneeHitachi Kokusai Electric Inc.
InventorsSadao Nakashima, Tomoharu Shimada, Kenichi Ishiguro
Life of this patent
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Abstract
A heat treatment apparatus for performing a heat treatment on one or more substrates includes a substrate support device holding the substrates, the substrate support device having a main body and a contact portion being in contact with a substrate. A surface of the main body is made of a material different from that of the contact portion, and at least a surface of the contact portion is made of either glassy carbon or graphite.
Claims11
A heat treatment apparatus for performing a heat treatment on one or more substrates, comprising:
- a substrate support device holding said one or more substrates, the substrate support device including a main body and a contact portion being in contact with a substrate,
- wherein a surface of the main body is made of a material different from that of the contact portion, and at least a surface of the contact portion is made of either glassy carbon or graphite.
A semiconductor device fabricating method, comprising the steps of:
- loading one or more substrates into a reaction furnace;
- holding said one or more substrates by using a substrate support device wherein the substrate support device includes a main body and a contact portion being in contact with a substrate, and a surface of the main body is made of a material different from that of the contact portion, at least a surface region of the contact portion being made of glassy carbon or graphite;
- performing a heat treatment on said one or more substrates held in the substrate support device in the reaction furnace;
- and
- unloading said one or more substrates from the reaction furnace.
A substrate fabricating method, comprising the steps of:
- loading one or more substrates into a reaction furnace;
- holding said one or more substrates by using a substrate support device wherein the substrate support device includes a main body and a contact portion being in contact with a substrate, and a surface of the main body is made of a material different from that of the contact portion, at least a surface region of the contact portion being made of glassy carbon or graphite;
- performing a heat treatment on said one or more substrates held in the substrate support device in the reaction furnace;
- and
- unloading said one or more substrates from the reaction furnace.
Dependencies are inferred from the claim text.