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US 2003/0170560 A1Published application
Decomposition type resin
AssigneeIndustrial Technology Research Institute
InventorsChih-Shin Chuang, Tsing-Tang Song, Weir-Torn Jiaang
Life of this patent
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Abstract
A decomposition type resin having the formula (I): 1 wherein R′ and R″ are acrylic series polymers or norbornene series polymers, R′″ is divalent C1-20 linear or branched alkyl, C3-20 cyclic alkyl, C1-6 linear, branched or cyclic alkoxy, silyl, or alkylsilyl. The decomposition resin can be used to prepare photoresists. The contrast of the photoresist before and after exposure is increased, and the resolution is enhanced.
Claims21
A decomposition type resin, having the formula (I) wherein
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- R′ and R″ are acrylic series polymers or norbornene series polymers,
- R′″ is divalent C1-20 linear or branched alkyl, C3-20 cyclic alkyl, C1-6 linear, branched or cyclic alkoxy, silyl, or alkylsilyl.
Dependencies are inferred from the claim text.