Method for treating metallic surfaces and products formed thereby
AssigneeElisha Holding LLC
InventorsRobert L. Heimann, Bruce Flint, Ravi Chandran, Jonathan L. Bass, James S. Falcone JR.
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Abstract
An electroless or electrolytic process for treating metallic surfaces is disclosed. The disclosed process exposes the metallic surface to a first medium comprising at least one silicate, and then to a second medium comprising colloidal silica (additional processing steps can be employed before, between and after exposure to the first and second mediums). The first and second mediums can be electrolytic or electroless.
Claims18
A method for treating an electrically conductive surface comprising:
- contacting at least a portion of the surface with a first medium having a basic pH and substantially free of chromates and comprising at least one silicate wherein said at least one silicate has a ratio of SiO2 to metal oxide of less than about 3:22, and;
- contacting at least a portion of the surface with a second medium comprising at least one siliceous material.
An aqueous medium for use in electrically treating a metallic surface comprising a combination comprising at least one polar carrier, at least one oligomeric silicate soluble within said carrier, colloidal silica, and wherein the medium has a basic pH and is substantially free of chromates.
A method for treating a metallic or an electrically conductive surface comprising:
- exposing at least a portion of the surface to a first medium comprising a combination comprising at least one polar carrier and at least one oligomeric silicate that is soluble within said carrier wherein said medium has a basic pH, and;
- exposing at least a portion of the surface to a second medium comprising colloidal silica.
Dependencies are inferred from the claim text.