Electrostatic chuck and method of treating substrate using electrostatic chuck
AssigneeHitachi High-Technologies Corporation
InventorKouichi Yamamoto
Life of this patent
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Abstract
An electrostatic chuck comprises a sample stage 9 provided with electrodes 1, 2 and 3 for applying n-phase alternating voltage wherein n is equal to or greater than 2, and a circuit for applying the n-phase alternating voltage. The present electrostatic chuck realizes smooth and speedy attraction/separation of the substrate without the need for a charge elimination process, and the present chuck solves the problem of substrate vibration.
Claims10
An electrostatic chuck having alternating voltage applied thereto, wherein said alternating voltage is an n-phase alternating voltage where n is equal to or greater than 2, said electric chuck comprising a sample stage including plural electrodes for applying said n-phase alternating voltage and an insulator for insulating the space between said electrodes, and a circuit for applying said n-phase alternating voltage.
A sample stage of an electrostatic chuck having alternating voltage applied thereto, wherein said alternating voltage is an n-phase alternating voltage where n is equal to or greater than 2, said sample stage comprising plural electrodes for applying said n-phase alternating voltage and an insulator for insulating the space between said electrodes.
A substrate processing method for processing a substrate in a vacuum processing equipment equipped with an electrostatic chuck having alternating voltage applied thereto, said alternating voltage being an n-phase alternating voltage where n is equal to or greater than 2, said electric chuck comprising a sample stage including plural electrodes for applying said n-phase alternating voltage and an insulator for insulating the space between said electrodes, and a circuit for applying said n-phase alternating voltage, wherein said substrate processing method comprises the steps of:
- mounting a substrate on a sample stage installed in a vacuum chamber and holding said substrate to position by electrostatic attraction force;
- introducing process gas into the vacuum chamber;
- providing vacuum processing to the substrate by the introduced process gas;
- stopping introduction of process gas after said vacuum processing;
- turning the electrostatic attraction force off;
- and
- taking out the vacuum-processed substrate.
Dependencies are inferred from the claim text.