Method for stacking semiconductor package units and stacked package
AssigneeSampson Taiwan Ltd.
InventorChad Yau
Life of this patent
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Abstract
A stacked package of semiconductor packaging units includes a direct electrical connection between leads of an upper semiconductor package unit, and includes direct electrical connections between selected leads of the upper semiconductor package unit and a lower semiconductor package unit. Leads of the upper semiconductor package unit are straightened, and chip-select and clock-enable leads are shortened and electrically connected to adjacent not-connected leads. Selected leads of the upper semiconductor package unit are electrically connected directly to underlying leads of the lower semiconductor packaging unit. Electrical connections preferably are solder connections.
Claims20
A method for forming a stacked package of at least an upper semiconductor package unit and a lower semiconductor package unit, the method comprising:
- (a) flattening leads of said upper semiconductor package unit;
- (b) shortening at least one selected lead of said upper semiconductor package unit such that the shortened said lead does not contact a lead of said lower semiconductor package unit when said upper semiconductor package unit is stacked atop said lower semiconductor package unit in a same orientation;
- (c) stacking said upper semiconductor package unit on said lower semiconductor package unit in said same orientation;
- (d) forming a direct electrical connection between two leads of said upper semiconductor package unit;
- and
- (e) forming direct electrical connections between leads of said upper semiconductor package units and corresponding leads of said lower semiconductor package unit.
A stacked package of semiconductor package units, the stacked package comprising:
- an upper semiconductor package unit having upper leads, an upper package, and having at least a first shortened upper lead that is electrically connected to a second upper lead;
- a lower semiconductor package unit comprising lower leads and a lower package;
- and
- an electrical connection between at least one selected upper lead and an underlying lower lead.
Dependencies are inferred from the claim text.