Dielectric test structure and test method

A test method for a dielectric layer having a dielectric test structure thereon, wherein the dielectric test structure comprises a first structure and a second structure;

• the first structure includes a first liner pad, a second liner pad and a first conductive layer connecting the first liner pad and the second liner pad;
• the second structure includes a first section and a second section, the first section comprises a third liner pad, a second conductive layer parallel to the first conductive layer between the third liner pad and the first conductive layer of the first structure and a third conductive layer connecting the second conductive layer and the third liner pad, the second section comprises a fourth liner pad, a fourth conductive layer parallel to the first conductive layer between the fourth liner pad and the first conductive layer of the first structure and a fifth conductive layer connecting the fourth conductive layer and the fourth liner pad, the method comprising the steps of:
• passing an electrical current into the first structure;
• and
• measuring the voltage at the first liner pad and the voltage at the second liner pad and finding metallic resistance of the first structure using the value of the electrical current and the measured voltages.

A method of testing a dielectric layer using a dielectric test structure formed over a first dielectric layer, wherein the test structure includes a first structure and a second structure having a first section and a second section, the first structure includes a first liner pad, a second liner pad and a first conductive layer connecting the first and the second liner pad, the first section and the second section of the second structure are on each side of the first conductive layer, the first section further includes a third liner pad, a second conductive layer parallel to the first conductive layer between the third liner pad and the first conductive layer of the first structure and a third conductive layer connecting the second conductive layer and the third liner pad, the second section further includes a fourth liner pad, a fourth conductive layer parallel to the first conductive layer between the fourth liner pad and the first conductive layer of the first structure, and a fifth conductive layer connecting the fourth conductive layer and the fourth liner pad, the test structure further includes a second dielectric layer over the first dielectric layer and a metallic layer over the second dielectric layer, the method comprising the steps of:

• applying a mechanical force to the metallic layer;
• feeding a first electrical current through the first structure;
• providing a voltage differential between the third liner pad and the fourth liner pad of the second structure;
• determining a second electrical current flowing through the second structure to obtain intensity of inter-layer electrical current leaked from the first dielectric layer;
• and
• measuring a first voltage at the first liner pad and a second voltage at the second liner pad of the first structure so that metallic resistance of the first structure can be found using the difference between the first and second voltage and the measured first electrical current.