Microwave monolithic integrated circuit package
AssigneeXytrans, Inc.
InventorDan F. Ammar
Life of this patent
Estimating the term…
Abstract
A microwave monolithic integrated circuit (MMIC) package includes a MMIC and a base plate that is matched as to its coefficient of thermal expansion (CTE) with the MMIC. A solder preform is contained on the base plate. The MMIC is mounted on the solder preform. A chip cover covers the MMIC and are configured with respective portions that engage each other such that any pads on the MMTC are exposed for wire and ribbon bonding. The base plate and MMIC are secured together by a solder flow process from the solder preform.
Claims20
A microwave monolithic integrated circuit (MMIC) package comprising:
- a MMIC;
- a base plate that is matched as to its coefficient of thermal expansion (CTE) with the MMIC;
- a solder preform contained on the base plate, said MMIC being mounted on the solder preform;
- and
- a chip cover covering the MMIC, wherein the base plate and chip cover are configured with respective portions that engage each other and such that any pads on said MMIC are exposed for wire and ribbon bonding thereto, wherein the base plate and MMIC are secured together by a solder flow process from said solder preform.
A microwave monolithic integrated circuit (MMIC) package comprising:
- a MMIC;
- a substantially rectangular configured base plate that is matched as to its coefficient of thermal expansion (CTE) with the MMIC, said base plate including opposing side rails that extend along a portion of formed edges;
- a solder preform contained on the base plate, said MMIC being mounted on the solder preform;
- and
- a chip cover covering the MMIC, and secured on said side rails of said base plate, and having overlap legs extending down to said base plate, wherein the base plate, side rails, chip cover and overlap legs are configured such that any pads on said MMIC are exposed for wire and ribbon bonding thereto.
A method of forming a monolithic integrated circuit (MMIC) package comprising the steps of:
- providing a base plate that is matched as to its coefficient of thermal expansion (CTE) with a MMIC to be packaged;
- placing a solder preform onto the base plate;
- placing a MMIC onto the solder preform;
- placing a cover onto the MMTC to cover the chip, wherein the base plate and cover are configured such that any pads on the MMIC are exposed for wire and ribbon bonding thereto;
- and
- heating to flow the solder and secure the MMIC to the base plate.
Dependencies are inferred from the claim text.