Wire bond package with core ring formed over I/O cells

Abstract

A wire bond package for an integrated circuit die includes a first I/O core ring and a second I/O core ring formed in a first metal layer; a pad strap formed in a second metal layer overlapping the second I/O core ring; a via formed between the first metal layer and the second metal layer where the second I/O core ring and the pad strap overlap; a first core ring formed in a third metal layer overlapping the first I/O core ring; a via formed between the first metal layer and the third metal layer where the first I/O core ring and the first core ring overlap outside the power strap; a first power mesh formed in a fourth metal layer overlapping the first core ring; and a via formed between the third metal layer and the fourth metal layer where the first core ring and the first power mesh overlap.

Dependencies are inferred from the claim text.