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AssigneeLSI Logic Corporation
InventorsGary K. Giust, Ruggero Castagnetti, Yauh-Ching Liu, Shiva Ramesh
Estimating the term…
A severable horizontal portion of a fuse link is formed relative to a vertically configured structure in an IC to promote separation of the severable portion upon applying energy from a laser beam. The vertically configured structure may be a reduced vertical thickness of the severable portion, an elevated lower surface of the severable portion above adjoining portions of the fuse link, a protrusion which supports the severable portion at a height greater than a height of the adjoining portions of the fuse link, flowing the melted severable portion down sloped surfaces away from a break point, and a propellent material beneath the severable portion which explodes to ablate the severable portion.
A fuse link extending generally horizontally in an integrated circuit (IC), the fuse link including a severable portion which is severed by energy applied from a laser beam to a predetermined vertically configured structure within the IC over which the severable portion extends and which promotes separation of the severable portion at a break point.
A method of fabricating a fuse link extending generally horizontally in an integrated circuit (IC), comprising the steps of:
Dependencies are inferred from the claim text.