EEPROM memory cell with high radiation resistance
AssigneeMacronix International Co., Ltd.
InventorsFuh-Cheng Jong, Kent Kuohua Chang
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AssigneeMacronix International Co., Ltd.
InventorsFuh-Cheng Jong, Kent Kuohua Chang
Estimating the term…
An EEPROM memory cell with high radiation resistance is provided. The present EEPROM memory cell comprises a semiconductor substrate of a first conductivity, a source having a region of the semiconductor substrate doped to have a second conductivity opposite to the first conductivity, a drain spaced from the source and having a region of the semiconductor substrate doped to have the second conductivity, a channel formed in the space between the source and the drain within the semiconductor substrate, a first oxide layer with a first thickness overlying and covering the channel of the semiconductor substrate, a conducting charge trapping layer formed on the first oxide layer, a second oxide layer with a second thickness more than the first thickness of the first oxide layer, overlying and covering the conducting charge trapping layer and a conducting gate layer formed on the second oxide layer.
An EEPROM memory cell with high radiation resistance, comprising:
A floating gate EEPROM memory cell with high radiation resistance, comprising:
Dependencies are inferred from the claim text.