Finger metal-insulator-metal capacitor with local interconnect
OwnerLenvis Liu, CJ Hwanginventors
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Abstract
The present invention includes a method of constructing a novel capacitor and geometry for the capacitor. The method and device include forming a multilayer structure having what generally can be described as a wave shape. Particular aspects of the present invention are described in the claims, specification and drawings.
Claims23
A method of manufacturing a wave-shaped capacitor over a base conductive layer, said base conductive layer over a base insulator layer on a die, including:
- patterning the base conductive layer to form at least two adjacent trenches;
- forming a multilayer structure, conformed to the trenches and isolated from adjacent structures, including at least a first plate layer, an insulating layer over the first plate layer, and a second plate layer over the insulating layer, wherein at least part of the first plate layer is in electrical communication with the base conductive layer;
forming interconnects on the die, including at least one interconnect with the second plate layer.
The method of claim 11, in which the trenches are formed by one or more lithographic or direct writing processes and the multilayer structure has a thickness along the sidewalls of the trenches that is less than a minimum feature size of the lithographic or direct writing process.
A wave-shaped capacitor, formed over a base conductive layer, said base conductive layer over a base insulator layer on a die, the capacitor including:
- a wave-shaped pattern in the base conductive layer comprising at least two adjacent trenches in the base conductive layer;
- a multilayer structure contoured over the base conductive layer, the multilayer structure comprising:
- a first plate layer in electrical contact with the base conductive layer;
- an insulating layer over the first plate layer;
- a second plate layer over the insulating layer;
- and
- a interconnect layer over the multilayer structure, including at least one interconnection with the second plate layer.
Dependencies are inferred from the claim text.