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US 2003/0155333 A1Published application
Method and apparatus for cutting a substrate using laser irradiation
AssigneeData Storage Institute
InventorsKaidong Ye, Chengwu An, Minghui Hong, Yongfeng Lu
Life of this patent
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Abstract
The invention relates to a method and apparatus for cutting a substrate using laser irradiation. A laser beam is scanned over a substrate. The beam ablates a first layer of the substrate. The beam is then refocused onto the newly revealed second layer and a further pass is performed. The process is repeated until complete separation occurs. The method and apparatus are particularly suitable for singulation of IC packages.
Claims16
1) A method of cutting a substrate comprising the steps of:
- a) focusing laser energy onto a point on the substrate so as to provide a laser focus point on the substrate;
- b) effecting relative lateral movement between the said laser focus point and the said substrate so that the said point follows a first path on the said substrate, a first layer of the said substrate being removed along the said first path so as to reveal a second layer of the said substrate;
- c) refocusing the laser energy onto the said second layer, so that the laser focus point is located on the said second layer;
- and
- d) effecting relative lateral movement between the said laser focus point and the said substrate so that the said point again follows substantially the said first path on the said substrate, whereby a second layer of the said substrate is removed along the said first path.
2 more elements
9) Apparatus for cutting a substrate comprising:
- a) a laser beam source;
- b) focusing means for focusing the said laser beam onto a particular point on the substrate so as to provide a laser focus point on the substrate;
- c) relative motion generating means for effecting relative lateral movement between the said laser focus point and the said substrate so that the said point follows a first path on the said substrate, a first layer of the said substrate being removed along the said first path so as to reveal a second layer of the said substrate;
- refocusing means being provided to refocus the laser beam onto the said second layer, relative motion between the laser focus point and the substrate again being effected along the said first path so as to remove a second layer of the said substrate along the said path.
1 more element
Dependencies are inferred from the claim text.