Substrate processing apparatus

Abstract

A substrate processing apparatus performing prescribed processing on a substrate is provided with a CD measuring unit serving as an inspection unit, an asher unit serving as a regenerative processing unit and a cleaning unit performing cleaning. After the substrate processing apparatus performs resist coating, exposure, development and the like on the substrate and terminates the development, a transport robot transfers the substrate to the CD inspection unit so that the CD inspection unit inspects whether or not the line width of a resist film formed through the development is within the range of a prescribed value. The transport robot transfers a substrate having a line width deviating from the prescribed value to the asher unit so that the asher unit regenerates the substrate by removing the resist film, the cleaning unit cleans the substrate and thereafter the substrate processing apparatus performs prescribed processing again. Thus, a substrate processing apparatus reducing a burden for transferring a defective substrate in the regenerative processing can be provided.

Dependencies are inferred from the claim text.