Method for preventing chemical attack on a copper containing semiconductor wafer
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTsu Shih, Ying-Tsung Chen
Life of this patent
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Abstract
A method for preventing a photo-induced chemical attack on a copper containing dielectric material including providing a copper or copper oxide containing dielectric material having an exposed copper containing surface; providing an acidic cleaning solution for contacting the exposed copper containing surface; and, shielding the exposed copper containing surface to substantially block incident light from impacting the exposed copper containing surface while contacting the exposed copper containing surface with the cleaning solution.
Claims20
A method for preventing a photo-induced chemical attack on a copper containing dielectric material comprising the steps of:
- providing a copper or copper oxide containing dielectric material having an exposed copper containing surface;
- providing an acidic cleaning solution for contacting the exposed copper containing surface;
- and
- shielding the exposed copper containing surface to substantially block incident light from impacting the exposed copper containing surface while contacting the exposed copper containing surface with the cleaning solution.
A method for preventing photo-induced chemical attack of a cleaning solution on a copper containing dielectric layer in a semiconductor wafer comprising the steps of:
- providing a copper containing semiconductor wafer having an exposed surface including a copper containing dielectric layer;
- providing a cleaning solution for contacting the copper containing dielectric layer;
- and
- shielding the cleaning solution and the copper containing dielectric layer to substantially block incident light while contacting the copper containing dielectric layer with the cleaning solution.
Dependencies are inferred from the claim text.