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US 2003/0154659 A1Published application
Polishing composition
AssigneeRodel Holdings, Inc.
InventorsHaofeng Xu, John Quanci
Life of this patent
Estimating the term…
Abstract
A polishing composition for polishing a semiconductor wafer includes comprises water, an abrasive that is preferably colloidal silica, water-soluble cellulose having a molecular weight of at least about 1,000,000 and an alkaline compound that is preferably ammonia. Tetra methyl ammonium hydroxide may also be added to the polishing composition.
Claims37
A polishing composition comprising:
- peanut-like shaped colloidal silica particles;
- water-soluble cellulose;
- ammonia;
- and
- water.
2 more elements
A polishing composition comprising:
- an abrasive;
- water-soluble cellulose having a molecular weight of at least about 1,000,000;
- an alkaline compound;
- and
- water.
2 more elements
A polishing composition comprising:
- an abrasive;
- water-soluble cellulose having a polydispersity of at least about 5 MW/Mn;
- an alkaline compound;
- and
- water.
2 more elements
Dependencies are inferred from the claim text.