Focused ion beam visual endpointing
AssigneeIntel Corporation
InventorsSailesh C. Suthar, Paul J. Hack, Syed Nabeel Sarwar, Mary J. Martinez
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AssigneeIntel Corporation
InventorsSailesh C. Suthar, Paul J. Hack, Syed Nabeel Sarwar, Mary J. Martinez
Estimating the term…
semiconductor chip. The method comprises etching a backside of the semiconductor chip, the frontside including a first well with a first type of doping and a second well with a second type of doping; monitoring a backside of the semiconductor chip during etching; and determining when a first portion of the backside over one of the first and second wells differs from a second portion of the backside over the other of the first and second wells. A method for etch endpoint detection includes etching a backside of a semiconductor chip, the semiconductor chip having at least one doped well formed proximate a frontside of the semiconductor chip; monitoring the backside of the semiconductor chip during etching until at least one doped well becomes visible; and stopping etching after the doped well becoming visible.
A method for use in removing a portion of a semiconductor chip having a frontside and a backside, the method comprising:
A method for detecting an endpoint of an etch, the method comprising:
A method for etch endpoint detection, the method comprising:
A method for detecting an endpoint of an etch, the method comprising:
An article comprising a machine-readable medium that stores machine-executable instructions for detecting an endpoint of an etch, the instructions causing a machine to:
Dependencies are inferred from the claim text.