Process for manufacturing copper foil on a metal carrier substrate
AssigneeGould Electronics Inc.
InventorsJiangtao Wang, Dan Lillie, David B. Russell, Sidney J. Clouser
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Abstract
A method and apparatus for forming a relatively thin releasable layer of copper on a carrier substrate. First, a separation facilitating layer is provided on the carrier substrate. A layer of vapor-deposited copper is then formed over the separation facilitating layer to protect the separation facilitating layer during subsequent processing. Thereafter, the thickness of the copper layer is increased by the electrodeposition of copper onto the vapor-deposited layer. The copper layer is applied to a dielectric and is released from the carrier substrate at the separation facilitating layer.
Claims35
A method for producing a releasable copper foil on a carrier substrate, comprising the steps of:
- vapor-depositing a layer of copper onto a carrier substrate having a separation facilitating layer formed thereon, wherein the vapor-deposited layer protects the separation facilitating layer during subsequent processing;
- and
- electrodepositing a layer of copper onto the vapor-deposited layer of the metal, thereby increasing the thickness of the copper layer.
A component for use in forming a printed wiring board, comprising:
- a carrier substrate;
- a separation facilitating layer formed on the carrier substrate;
- a vapor-deposited layer of copper on the separation facilitating layer, wherein the vapor-deposited layer protects the separation facilitating layer;
- and
- an electrodeposited layer of copper on the vapor-deposited layer.
Dependencies are inferred from the claim text.