Integrated circuit having oversized components and method of manafacture thereof
AssigneeBroadcom Corporation
InventorsHarry Contopanagos, Christos Komninakis
Life of this patent
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Abstract
An integrated circuit includes electrical components that include one or more electrical elements on one or more dielectric layers. The electrical element has a geometric shape that exceeds prescribed integrated circuit manufacturing limits in at least one dimension. To achieve compliance with foundry rules, the electrical element is fabricated to include a non-conducting region that negligibly effects the electrical characteristics. The non-conducting region includes a hole, a series of holes, a slot and/or a series of slots spaced within the electrical element at dimensions that are less than the integrated circuit manufacturing limits.
Claims22
A method for manufacturing an integrated circuit comprises:
- creating a layer;
- and
- creating, on the layer, an electrical element having a geometric shape that exceeds prescribed integrated circuit manufacture limits, wherein the electrical element includes at least one non-conducting region that negligibly effects electrical characteristics of the electrical element and provides adequate non-conducting spacing in accordance with the prescribed integrated circuit manufacture limits.
An integrated circuit comprises:
- a layer;
- and
- an electrical element on the layer, wherein the electrical element has a geometric shape that exceeds prescribed integrated circuit manufacture limits, wherein the electrical element includes at least one non-conducting region that negligibly effects electrical characteristics of the electrical element and provides adequate non-conducting spacing in accordance with the prescribed integrated circuit manufacture limits.
Dependencies are inferred from the claim text.