IC package feeder

An IC package feeder comprising:

• a platform;
• a vibrator controlled to oscillate said platform back and forth;
• a material delivery tube path unit mounted on said platform at a top side near a rear side of said platform, said material delivery tube path unit comprising a plurality of rails longitudinally arranged in pair on said platform, each pair of the rails of said material delivery tube path unit defining a respective material delivery tube passage, each pair of the rails of said material delivery tube path unit having at least one rail adjustable on said platform in transverse direction between two opposite lateral sides of said platform;
• an IC package path unit mounted on said platform at a top side near a front side of said platform, said IC package path comprising first rod members and second rod members alternatively longitudinally arranged on said platform and defining a plurality of IC package passages respectively aligned in line with said material delivery tube passages of said material delivery tube path unit, the first rod members and said second rod members being relatively movable to adjust the width of said IC package passages, said first rod members each having a sloping edge disposed at an inner side such that said IC package passages each have a tapered rear side gradually expanding backwards;
• and
• a cover vertically adjustably mounted on said platform near a front side of said platform and covering over the first and second rod members of said IC package path unit, said cover having sloping guide means disposed corresponding to the tapered rear sides of said IC package passages and adapted to guide IC packages from said material delivery tube path unit to said IC package passages.