Operating device for heat sink

An electronic device assembly, comprising:

• an electronic device;
• a printed circuit board;
• a socket connecting the electronic device to the printed circuit board;
• a heat sink mounted on the electronic device for dissipating heat therefrom;
• and
• an operating device comprising:
• a bracket disposed generally between the heat sink and the electronic device, the bracket comprising two first beams and two second beams, a pivot being arranged at each of opposite ends of the first beams;
• and
• a plurality of handles movably connected with the bracket, each of the handles comprising an operating portion and a pressing portion, a pivot hole being defined at a junction of the operating portion and the pressing portion, the pivot hole movably receiving a corresponding pivot of the bracket.

An electronic device assembly comprising:

• a printed circuit board;
• a socket secured on the printed circuit board;
• an electronic device comprising a base and a protrusion;
• a heat sink attached on the protrusion;
• a bracket disposed generally between the heat sink and the electronic device, and defining an opening receiving the protrusion therein;
• and
• a plurality of handles pivotably engaged with the bracket and spaced from the socket, wherein the handles can pivotingly contact the socket for facilitating detachment of the heat sink from the electronic device.

An electrical assembly comprising:

• a printed circuit board;
• a socket module mounted on the printed circuit board and connecting an electronic device to the printed circuit board;
• a heat sink positioned upon the electronic device;
• and
• at least one operating device equipped with one of said socket module and said heat sink;
• wherein
• said operating device is configured not only not to hinder abutment between the heat sink and the electronic device when said heat sink is pressed against the electronic device and spaced from the socket module in a minimum distance, but also to be moveable to increase the said minimum distance when said heat sink is intended to be detached from said electronic device.