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AssigneeShin-Etsu Chemical Co., Ltd.
InventorsHiroaki Tetsuka, Kunihiko Mita, Kunihiro Yamada, Yoshitaka Aoki, Tsutomu Yoneyama
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A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an interlayer comprising a metal foil and/or metal mesh having a thickness of 1-50 μm and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler formed on both surfaces of the interlayer such that the overall thickness is within the range of 40-500 μm. This heat-dissipating member is non-fluid at room temperature, but due to the action of heat emitted when the electronic component operates, its viscosity decreases, and it softens or melts based on the phase transition of the resin and low melting point metal so that it is effectively in intimate contact with the boundary between the electronic component and heat-dissipating component without any gaps. The thermally-conducting filler contains a low melting point metal powder (1) having a melting temperature of 40-250° C. and a particle diameter of 0.1-100 μm, together with a thermally-conducting powder (2) having a melting temperature exceeding 250° C. and an average particle diameter of 0.1-100 μm, such that (1)/[(1)+(2)]=0.2-1.0.
A heat dissipating member installed (at the boundary) between a heat dissipating electronic component which reaches a higher temperature than room temperature due to its operation, and a heat-dissipating component which dissipates the heat produced by said heat dissipating electronic component, wherein said heat-dissipating member is a thermally-conducting silicone resin composition comprising 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler, said member is non-fluid at room temperature prior to the operation of said electronic component, but due to the emission of heat when said electronic component operates, said member loses its viscosity, softens or melts so as to effectively fill the gap between said electronic component and said heat-dissipating component, said thermally-conducting filler comprising a low melting point metal powder (1) having a melting temperature of 40-250° C. and a particle diameter of 0.1-100 μm, together with a thermally-conducting powder (2) having a melting temperature exceeding 250° C. and an average particle diameter of 0.1-100 μm, said filler being used such that (1)/[(1)+(2)]=0.2-1.0.
A method of manufacturing a heat-dissipating member, wherein 1,000-3,000 wt parts of a low melting point metal powder (1) having a melting temperature of 40-250° C. and a particle diameter of 0.1-100 μm, and a thermally-conducting powder (2) having a melting temperature exceeding 250° C. and an average particle diameter of 0.1-100 μm as a filler wherein (1)/[(1)+(2)]=0.2-1.0, is mixed and kneaded with 100 wt parts of a silicone resin at a temperature below the melting point of said low melting point metal.
A method of manufacturing a heat-dissipating member wherein a thermally-conducting composition comprising 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler is coated on both surfaces of an interlayer selected from metal foil and metal mesh, wherein said thermally-conducting filler contains a low melting point metal powder (1) having a melting temperature of 40-250° C. and a particle diameter of 0.1-100 μm, and a thermally-conducting powder (2) having a melting temperature exceeding 250° C. and an average particle diameter of 0.1-100 μm, such that (1)/[(1)+(2)]=0.2-1.0, and said thermally-conducting composition is prepared by mixing and kneading the ingredients at a temperature below the melting point of said low melting point metal.
Dependencies are inferred from the claim text.