Lead-frame forming for improved thermal performance
OwnerMichael J. Hundt, Tiao Zhouinventors
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Abstract
A lead frame of a plastic integrated circuit package is fabricated in two steps. First, from a rectangular sheet of metal, lead fingers of the lead frame are formed. Second, the die pad of the lead frame is clamped and is simultaneously separated and downset from the lead fingers of the lead frame by shearing the lead frame with a mated punch die pair. Performing the separation and downset of the die pad from the lead fingers results in essentially no horizontal gap between the lead fingers and the die pad. The downset of the die pad with respect to the lead fingers results in a vertical separation between the die pad and the lead fingers.
Claims7
A method for fabricating a lead frame of a plastic integrated circuit device package, comprising:
- defining a plurality of lead fingers of the lead frame;
- and
- simultaneously separating a die pad of the lead frame from the plurality of lead fingers and downsetting the die pad from the plurality of lead fingers to produce a vertical separation between the die pad and the plurality of lead fingers, wherein separating the die pad from the plurality of lead fingers results in essentially no horizontal gap between the die pad and the plurality of lead fingers.
A method for fabricating a lead frame of a plastic integrated circuit device package, comprising:
- defining a plurality of lead fingers of the lead frame;
- separating a die pad of the lead frame from the plurality of lead fingers, wherein separating the die pad from the plurality of lead fingers results in essentially no horizontal gap between the die pad and the plurality of lead fingers;
- and
- downsetting the die pad from the plurality of lead fingers to produce a vertical separation between the die pad and the plurality of lead fingers.
A lead frame of an integrated circuit device package, comprising:
- a plurality of lead fingers;
- and
- a die pad, wherein the die pad is separated from the plurality of lead fingers with essentially no horizontal gap between the die pad and the plurality of lead fingers.
Dependencies are inferred from the claim text.