Loading patent…
AssigneeDaikin Industries, Ltd.
InventorsKatsuhiko Higashino, Hiroyuki Tanaka, Takafumi Yamato, Tsuyoshi Noguchi
Estimating the term…
There is provided an elastomer composition which is prepared by using a very clean filler reduced in both of an amount of moisture generation and an amount of organic outgas generation and is suitable as a molding material for semiconductor production apparatuses and there is provided a molded article. The composition is a crosslinkable composition comprising a high molecular weight polymer, particularly a crosslinkable fluorine-containing elastomer and a filler which has a weight reduction ratio per unit surface area of not more than 2.5×10−5% by weight/m2 when heating at 200° C. for two hours and a total amount of organic gas generated of not more than 2.5 ppm when heating at 200° C. for 15 minutes. The molded article is produced from the crosslinkable composition.
A high molecular weight polymer composition comprising a high molecular weight polymer and a filler, in which when the filler is heated at 200° C. for two hours, a weight reduction ratio per unit surface area of the filler is not more than 2.5×10−5% by weight/m2 and when the filler is heated at 200° C. for 15 minutes, a total amount of organic gas generated from the filler is not more than 2.5 ppm.
A filler which has a weight reduction ratio per unit surface area of not more than 2.5×10−5% by weight/m2 when heating at 200° C. for two hours and a total amount of an organic gas generated of not more than 2.5 ppm when heating at 200° C. for 15 minutes.
Dependencies are inferred from the claim text.