Polyimide precursor, manufacturing method thereof, and resin composition using polyimide precursor
AssigneeKaneka Corporation
InventorsToshio Yamanaka, Koji Okada, Kaoru Takagahara
Life of this patent
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Abstract
A polyimide precursor in accordance with the present invention contains amide acid ester units, either imide units or amide acid units, and fluorine atoms bonded to some of these structural units. A polyimide precursor resin composition in accordance with the present invention contains either such a polyimide precursor or resins separately containing the structural units. Polyimide precursors in accordance with the present invention and resin compositions based on the same therefore have excellent properties and are suitably used in particular to form a particular pattern and for other purposes by impart photosensitivity to them.
Claims19
A polyimide precursor, comprising:
- at least one first structural unit (1);
- and
- either at least one second structural unit (2) or at least one third structural unit (3),
- 19
- where R1 is a tetravalent organic group, R2 is a divalent organic group, R3 is a monovalent organic group, and m is an integer greater than or equal to 1,
- 20
- where R4 is a tetravalent organic group, R5 is a divalent organic group, and n is an integer greater than or equal to 1, and
- 21
- where R4 is a tetravalent organic group, R5 is a divalent organic group, and p is an integer greater than or equal to 1.
A polyimide precursor resin composition containing a polyimide precursor, comprising:
- at least one first structural unit (1);
- and
- either at least one second structural unit (2) or at least one third structural unit (3),
- 22
- where R1 is a tetravalent organic group, R2 is a divalent organic group, R3 is a monovalent organic group, and m is an integer greater than or equal to 1,
- 23
- where R4 is a tetravalent organic group, R5 is a divalent organic group, and n is an integer greater than or equal to 1, and
- 24
- where R4 is a tetravalent organic group, R5 is a divalent organic group, and p is an integer greater than or equal to 1.
A polyimide precursor resin composition, comprising:
- a polyimide precursor (A) containing at least one first structural unit (1);
- and
- at least either a polyimide (B) containing at least one second structural unit (2) or a polyamide acid (C) containing at least one third structural unit (3),
- 25
- where R1 is a tetravalent organic group, R2 is a divalent organic group, R3 is a monovalent organic group, and m is an integer greater than or equal to 1,
- 26
- where R4 is a tetravalent organic group, R5 is a divalent organic group, and n is an integer greater than or equal to 1,
- 27
- where R4 is a tetravalent organic group, R5 is a divalent organic group, and p is an integer greater than or equal to 1.
A method of manufacturing a polyimide precursor, comprising the step of synthesizing a polyamide acid by reacting a compound (4) having an amine end with at least one of two compounds (5) and (6) having an acid anhydride end,
- 28
- where R1 is a tetravalent organic group, R2 is a divalent organic group, R3 is a monovalent organic group, and m is an integer greater than or equal to 1, and
- 29
- where each R4 is a tetravalent organic group, each R5 is a divalent organic group, and p is an integer greater than or equal to 1.
Dependencies are inferred from the claim text.