Polymer for photoresist and resin compositions therefor
AssigneeDaicel Chemical Industries, Ltd.
InventorsYoshinori Funaki, Kiyoharu Tsutsumi, Keizo Inoue, Tomoko Adachi
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AssigneeDaicel Chemical Industries, Ltd.
InventorsYoshinori Funaki, Kiyoharu Tsutsumi, Keizo Inoue, Tomoko Adachi
Estimating the term…
A polymeric compound for photoresist of the invention includes at least one monomer unit represented by following Formula (I): 1 wherein R1, R2, R3, R4 and R5 are the same or different and are each a hydrogen atom or a methyl group; m, p and q each denote an integer of from 0 to 2; and n denotes 0 or 1, where the hydroxyl group and carbonyloxy group extending from a principle chain in the formula are independently combined with either of two carbon atoms on the far-left portion of the rings. By using the polymeric compound for photoresist as a base of a photoresist, the resulting photoresist exhibits well-rounded adhesion to substrates and resistance to etching.
A polymeric compound for photoresist, comprising at least one monomer unit represented by following Formula (I):
A (meth)acrylic ester derivative represented by following Formula (1):
A process for producing a (meth)acrylic ester derivative, the process comprising the step of allowing a cyclic alcohol represented by following Formula (4):
A process for producing a cyclic alcohol, the process comprising the step of reducing an epoxy compound represented by following Formula (5):
A cyclic alcohol represented by following Formula (4b):
Dependencies are inferred from the claim text.