Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board
OwnerMiki Kurosawa, Tsukasa Fukushima +4inventors
InventorsMIKI KUROSAWA, TSUKASA FUKUSHIMA, MASANORI MIZUNO, SHOZUI TAKENO, MASAHARU MORIYASU, MASAYUKI KANEKO
Life of this patent
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Abstract
In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 μs and with energy density of about 20 J/cm2 or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape.
Claims22
A laser beam machining method for a wiring board, using a laser beam for machining such as drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape of the wiring board, and the method comprising the step of:
- irradiating a machined portion of the wiring board with the pulsed laser beam for a beam irradiation time ranging from 10 to 200 μs and with energy density of 20 J/cm2 or more.
A laser beam machining method for a wiring board, using a laser beam for machining such as drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape of the wiring board, and the method comprising the step of:
- irradiating the same machined portion of the wiring board with the pulsed laser beam with intervals of a beam irradiation pausing time of 15 ms or more and energy density of 20 J/cm2 or more.
A laser beam machining method for a wiring board, using a laser beam for machining such as drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape of the wiring board, and the method comprising the steps of:
- combining into one pulse group laser beams including a plurality of pulses respectively having energy density of 20 J/cm2 or more and generated at intervals of a predetermined beam irradiation pausing time;
- and
- irradiating the same machined portion of the wiring board with a pulsed laser beam with the plurality of pulse groups respectively including the plurality of pulses at intervals of a pulse group interval irradiation pausing time longer than the predetermined beam irradiation pausing time.
A laser beam machining method for a wiring board, using a laser beam for machining such as drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape of the wiring board, and the method comprising the step of:
- at a time of scanning a surface of the wiring board while irradiating a machined portion of the wiring board with the pulsed laser beam, scanning by the laser beam such that the machined portion is not continuously irradiated with the laser beam over 4 pulses and at intervals of a beam irradiation pausing time less than 15 ms.
A laser beam machining method for a wiring board, using a laser beam for machining such as drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape of the wiring board, and the method comprising the steps of:
- at a time of scanning a surface of the wiring board while irradiating a machined portion of the wiring board with the pulsed laser beam, providing a 1 mm beam diameter on a surface of the machined portion;
- and
- scanning the surface of the wiring board at a scanning speed ranging from 8 to 6 m/min while irradiating the machined portion with the laser beam for a beam irradiation time ranging from 10 to 200 μs and at intervals of a beam irradiation pausing time of 2.5 ms.
A laser beam machining method for a wiring board, using a laser beam for machining such as drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape of the wiring board, and the method comprising the steps of:
- setting the laser beam to have a square spot effective in machining of a machined portion of the wiring board;
- and
- scanning a surface of the wiring board while irradiating the machined portion of the wiring board with the pulsed laser beam.
A laser beam machining method for a wiring board, using a laser beam for machining such as drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape of the wiring board with a metallic layer formed on a base material surface, and the method comprising the steps of:
- previously removing the metallic layer corresponding to a machined portion of the wiring board;
- forming a base material removed portion through machining by irradiating a base material of the machined portion with a laser beam through the metallic layer removed portion;
- and
- additionally irradiating the base material removed portion and a periphery of the base material removed portion, or only the periphery of the base material removed portion with a laser beam.
A laser beam machining method for a wiring board, using a laser beam for machining such as drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape of the wiring board with a metallic layer formed on a base material surface, and the method comprising the step of:
- at a time of previously removing the metallic layer at a portion corresponding to a machined portion of the wiring board, partially removing the metallic layer such that the laser beam can reach only an outer periphery of a base material removed portion to be formed by irradiating a base material of the machined portion with the laser beam.
A laser beam machining method for a wiring board, using a laser beam for machining such as drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape of the wiring board with a metallic layer formed on a base material surface, and the method comprising the steps of:
- previously removing the metallic layer corresponding to a machined portion of the wiring board;
- and
- flowing a gas in a direction from a laser beam scanning start point to a laser beam scanning end point in the machined portion at a time of machining by irradiating a base material of the machined portion with a laser beam while scanning by the laser beam through the metallic layer removed portion.
A laser beam machining method for a wiring board, using a laser beam for machining such as drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape of the wiring board with a metallic layer formed on a base material surface, and the method comprising the steps of:
- forming the metallic layer having a desired shape by partially removing the metallic layer by pulse irradiation with a laser beam having sufficient intensity to melt and remove the metallic layer;
- and
- additionally irradiating a machined portion of the wiring board through the metallic layer removed portion with the laser beam having insufficient intensity to melt the metallic layer and a beam irradiation time ranging from 10 to 200 μs, and including a plurality of pulses forming a train at intervals of a beam irradiation pausing time of 15 ms or more.
A laser beam machining method for a wiring board, using a laser beam for machining such as drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape of the wiring board, and the method comprising the step of:
- at a time of pulse irradiation with the laser beam while sequentially positioning a spot of the laser beam at target positions on the wiring board in synchronization with a pulse frequency of the laser beam, providing a time interval of 15 ms or more between two optional successive pulsed laser beams for irradiation of the respective target positions irrespective of the pulse frequency by irradiating another target position with a pulsed laser beam outputted for the time interval therebetween.
A laser beam machining method for a wiring board, using a laser beam for machining such as drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape of the wiring board, and the method comprising the steps of:
- providing a plurality of machining stations on which the wiring boards to be machined are mounted;
- sequentially dividing a pulsed laser beam outputted from a laser oscillator among the plurality of machining stations for each pulse;
- and
- introducing the pulsed laser beam into the plurality of machining stations at time intervals of 15 ms or more.
A laser beam machining apparatus for a wiring board, using a laser beam radiated from a laser oscillator for machining such as drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape of the wiring board, and the apparatus comprising:
- optical means for changing a direction of the laser beam and moving the laser beam on the wiring board while sequentially positioning a spot of the laser beam at target positions on the wiring board, and
- control means for synchronous control between a pulse oscillating operation of the laser oscillator and an operation of the optical means, and control of the optical means such that a time interval can be set to 15 ms or more between two optional successive pulsed laser beams for irradiation of the target positions irrespective of a pulse frequency of the laser oscillator.
A laser beam machining apparatus for a wiring board, using a laser beam radiated from a laser oscillator for machining such as drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape of the wiring board, and the apparatus comprising:
- a plurality of machining stations on which the wiring boards to be machined are respectively mounted;
- optical means for sequentially dividing a pulsed laser beam outputted from the laser oscillator among the plurality of machining stations for each pulse, and introducing the pulsed laser beam into the plurality of machining stations for each pulse at time intervals of 15 ms or more;
- and
- synchronization control means for synchronous control between a dividing operation of the optical means and a pulse oscillating operation of the laser oscillator.
A carbonic acid gas laser oscillator for machining for a wiring board, comprising:
- a discharge space formed by feeding pulsed discharge power into a high-speed gas flow serving as a laser medium;
- and
- an aperture through which a laser beam is derived from the discharge space such that an optical axis of the laser beam can be perpendicular to the gas flow;
- wherein a length of the discharge space in a gas flow direction is equal to or more than a width of the aperture, an optical axis passing through a center of the aperture being set to be positioned in the range that an entire area of the aperture does not extend off an area extending in the gas flow direction of the discharge space and on the farthest upstream side of the gas flow, and a rise time and a fall time being set to 50 μs or less in the discharge power fed to the discharge space.
Dependencies are inferred from the claim text.