Method for improving performance of sputtering target
AssigneeHannstar Display Corp.
InventorsTun-Ho Teng, Yung-Fu Chen
Life of this patent
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Abstract
A method for improving a performance of a sputtering target in a magnetron sputtering system having at least one magnet repetitively and retracingly scanning between two sides thereof and receiving a power input changing with a scanning position of the magnet is provided. The method includes the steps of stepwise reducing the power input while the magnet approaches a specific distance range near a retracing point, so as to reduce an erosion rate of the sputtering target by the magnetron sputtering system, and increasing the power input to a specific value while the magnet leaves the specific distance range, wherein the power input changes with the scanning position of the magnet, so as to improve the performance of the sputtering target.
Claims24
A method for improving a performance of a sputtering target in a magnetron sputtering system having a magnet repetitively and retracingly scanning between two sides thereof and receiving a power input changing with a scanning position of said magnet, comprising steps of:
- stepwise reducing said power input while said magnet approaches a specific distance range near a retracing point, so as to reduce an erosion rate of said sputtering target by said magnetron sputtering system;
- and
- increasing said power input to a specific value while said magnet leaves said specific distance range, wherein said power input changes with said scanning position of said magnet, so as to improve said performance of said sputtering target.
A method for improving a performance of a sputtering target in a magnetron sputtering system having a magnet repetitively retracingly and scanning between two sides thereof and receiving a power input changing with a scanning position of said magnet, comprising steps of:
- defining a scanning center at a substantially half position of a scanning range of said magnet;
- reducing said power input gradually while said magnet is moved from said scanning center to a retracing point, so as to reduce an erosion rate of said sputtering target by said magnetron sputtering system;
- and
- raising said power input gradually while said magnet is moved from said retracing point to said scanning center, wherein said power input changes with said scanning position of said magnet, so as to improve said performance of said sputtering target.
Dependencies are inferred from the claim text.