Novel photoresist monomers, polymers thereof and photoresist compositions using the same

Abstract

The present invention provides compounds represented by formulas 1a and 1b; and photoresist polymers derived from the same. The present inventors have found that photoresist polymers derived from compounds of formulas 1a, 1b, or mixtures thereof, having an acid labile protecting group have excellent durability, etching resistance, reproducibility, adhesiveness and resolution, and as a result are suitable for lithography processes using deep ultraviolet light sources such as KrF, ArF, VUV, EUV, electron-beam, and X-ray, which can be applied to the formation of the ultrafine pattern of 4G and 16G DRAMs as well as the DRAM below 1G: 1 where R1, R2 and R3 are those defined herein.

Dependencies are inferred from the claim text.