System and method for using a pre-formed film in a transfer molding process for an integrated circuit
AssigneeSTMicroelectronics S.r.l.
InventorsHarry Michael Siegel, Anthony M. Chiu
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Abstract
A system and method is disclosed for using a pre-formed film in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit with a molding compound. A film of compliant material is pre-formed to conform the shape of the film to a mold cavity surface of the transfer mold. The pre-formed film is then placed adjacent to the surfaces of the mold cavity of the transfer mold. The mold cavity is filled with molding compound and the integrated circuit is encapsulated. The pre-formation of the film allows materials to be used that are not suitable for use with prior art methods.
Claims29
For use in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit within a molding compound, a method for using a pre-formed film in said transfer molding process, said method comprising the steps of:
- providing a film of compliant material;
- pre-forming said film of compliant material to conform a shape of said film to a mold cavity surface of said transfer mold;
- and
- placing said pre-formed film of compliant material within said transfer mold adjacent to said mold cavity surface of said transfer mold.
For use in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit within a molding compound, a method for using a pre-formed film in said transfer molding process, said method comprising the steps of:
- providing a tape made of a film of compliant material;
- pre-forming a portion of said tape to conform a shape of said portion of said tape to a mold cavity surface of said transfer mold;
- and
- placing said pre-formed portion of said tape within said transfer mold adjacent to said mold cavity surface of said transfer mold.
For use in a transfer molding process of the type that uses a top half of a transfer mold and a bottom half of a transfer mold to encapsulate portions of an integrated circuit within a molding compound, a method for using a pre-formed film in said transfer molding process, said method comprising the steps of:
- providing a first film of compliant material;
- pre-forming said first film of compliant material to conform a shape of said first film to a mold cavity surface of said top half of said transfer mold;
- placing said pre-formed first film of compliant material within said top half of said transfer mold adjacent to said mold cavity surface of said top half of said transfer mold;
- providing a second film of compliant material;
- pre-forming said second film of compliant material to conform a shape of said second film to a mold cavity surface of said bottom half of said transfer mold;
- and
- placing said pre-formed second film of compliant material within said bottom half of said transfer mold adjacent to said mold cavity surface of said bottom half of said transfer mold.
For use in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit within a molding compound, a pre-formed film of compliant material having a shape that conforms to a shape of mold cavity surface of said transfer mold.
For use in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit within a molding compound, a pre-formed tape comprising a film of compliant material, said tape comprising a plurality of portions wherein each portion of said tape has a shape that conforms to a shape of a mold cavity surface of said transfer mold.
For use in a transfer molding process of the type that uses a top half of a transfer mold and a bottom half of a transfer mold to encapsulate portions of an integrated circuit within a molding compound,
- a first pre-formed film of compliant material having a shape that conforms to a shape of a mold cavity surface of said top half of said transfer mold;
- and
- a second pre-formed film of compliant material having a shape that conforms to a shape of a mold cavity surface of said bottom half of said transfer mold.
Dependencies are inferred from the claim text.