Flat panel display device and method of forming passivation film in the flat panel display device

A method of forming a passivation film onto the flexible substsrate comprising the steps of:

• bringing a substrate into a chamber in order to form a passivation film;
• injecting precursors containing elements constituting the passivation film into the chamber;
• forming the passivation film of an inorganic insulating material at a temperature of 20˜220° C. through a surface chemical reaction between the precursors by an atomic layer deposition method;
• and
• manufacturing the flat panel display device on the substrate in which the passivation is formed on the entire surfaces, on the upper side, a lower side and lateral sides, or the surfaces including a portion of them.

A flat panel display device having a passivation film, comprising:

• a flat panel display device formed on a substrate with a metal film at its top layer;
• and
• the passivation film made of an inorganic insulating film on the metal film,
• wherein the inorganic insulating film includes an aluminum oxide film, aluminum nitride or silicon nitride, which is formed at a temperature of 20˜220° C. through a surface chemical reaction between precursors containing constituent elements of the inorganic insulating film by means of an atomic layer deposition method.

A flat panel display device having a passivation film, comprising:

• the passivation film of an inorganic insulating film formed on the entire surfaces including an upper, lower and lateral sides of a substrate or a part of the substrate;
• and
• a flat panel display formed on the substrate,
• wherein the inorganic insulating film includes an aluminum oxide film, aluminum nitride or silicon nitride, which is formed at a temperature of 20˜220° C. by means of an atomic layer deposition method through a surface chemical reaction between precursors containing elements constituting the inorganic insulating film.