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AssigneeHitachi, Ltd. and Hitachi ULSI Systems Co., Ltd.
InventorsKoji Hirata, Masataka Shirai, Tomoyoshi Mishima
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The present invention provides a module for optical transmitter formed as an opto-electronic integrated circuit (OEIC) for reducing the heat generated at a driver circuit for modulator and stabilizing the thermal fluctuation in an optical modulator. For promoting the heat dissipation of the top face of the driver circuit for modulator of the OEIC chip, a protruding cooling plate is formed on metal wiring. A part of a semiconductor substrate present between the optical modulator and the driver circuit for modulator is thinned or removed. Further, a carrier for mounting thereon the OEIC chip is divided into two parts, and a peltier cooler is connected to the optical modulator side. This achieves the promotion of heat dissipation from the top face of the driver circuit for modulator, the thermal separation between the optical modulator and the driver circuit for modulator, and the temperature stabilization due to the peltier cooler. The temperature rise and the temperature change of the optical modulator are suppressed, so that it is possible to manufacture a module for optical transmitter showing no characteristic deterioration, in which an optical modulator and a driver circuit for modulator are formed as an OEIC chip.
A module for optical transmitter mounting therein an IC chip including an opto-electronic optical modulator and a driver circuit for modulator formed as an opto-electronic integrated circuit on the same semiconductor substrate,
A module for optical transmitter mounting therein an IC chip including an opto-electronic optical modulator and a driver circuit for modulator formed as an opto-electronic integrated circuit on the same semiconductor substrate,
Dependencies are inferred from the claim text.