Power converter and method for producing the same

The power converter as recited in one of the preceding claims,

• wherein the mounting plates (11, 12) are made from copper or include copper.

The power converter as recited in one of the preceding claims,

• wherein semiconductor substrates (15) of two stacks (20) which are situated next to one another are implemented as individual chips or contiguously.

The power converter as recited in one of the preceding claims,

• wherein the mounting plates (11, 12) have an essentially plate-shaped design.

The method as recited in one of the preceding claims,

• wherein one semiconductor substrate (15) is first attached onto each of the two mounting plates (11, 12) using the contact means (36) and the semiconductor substrate (15) is then connected to the insert (18) using the contact means (36).

The method as recited in one of the preceding claims,

• wherein an electrically non-conductive spacer (25, 31) is placed between the two mounting plates (11, 12).

The method as recited in one of the preceding claims,

• wherein the spacer (25, 31) and the insert (18) form a separable assembly (25′).

The method as recited in one of the preceding claims,

• wherein multiple semiconductor substrates (15) are positioned next to one another on a mounting plate (11, 12).

The method as recited in one of the preceding claims,

• wherein the inserts (18) are connected to one another during assembly and are only separated from one another after the assembly of the power converter (1).

The method as recited in one of the preceding claims,

• wherein the free region existing between the two mounting plates (11, 12) is filled up using a casting compound.

The method as recited in one of the preceding claims,

• wherein the layers are pre-fixed using pre-fixing elements (27, 28, 28′).

The method as recited in one of the preceding claims,

• wherein the pre-fixing elements (27, 28, 28′) are removed after assembly.

The method as recited in one of the preceding claims,

• wherein the lateral edges (S) of the semiconductor substrates (15) are painted before introduction of the casting compound.

The method as recited in one of the preceding claims,

• wherein plastic is injected into the free region existing between the two mounting plates (11, 12).

The method as recited in one of the preceding claims,

• wherein the power converter (1) is at least partially extrusion-coated as a preassembled power converter assembly (1′) using plastic.

The method as recited in one of the preceding claims,

• wherein the extrusion-coating of the power converter assembly (1′) is performed according to a molding method, in which the power converter assembly (1′) is received by a mold into which the plastic compound is injected through an opening.

The method as recited in one of the preceding claims,

• wherein the mold is implemented in such a way that the three-phase terminal (9), the DC terminal (10), attachment means (22) implemented on the one mounting plate (12), and the bottom of the mounting plate (12) project out of the plastic compound forming the molded housing (37).

The method as recited in one of the preceding claims,

• wherein the other mounting plate (11) is situated completely inside the molded housing (37).

The method as recited in one of the preceding claims,

• wherein before the injection of the molded housing (37), a terminal lug (38), which projects out of the molded housing (37) after the injection, is attached to the other mounting plate (11).