Ring chuck to hold 200 and 300 MM wafer
AssigneeADE Corporation
InventorsChristopher Gaal, Jaydeep Sinha
Life of this patent
Estimating the term…
Abstract
A ring chuck that holds a wafer with a vacuum uses a vacuum trough that contacts the entire outer edge of the wafer. The chuck has a base having a top surface equal to or slightly smaller than a water to be tested with vacuum channels in the base. The base provides the mechanism to connect the chuck to a measurement instrument and a vacuum source. An annulus of non-contaminant material that has concentric rings extending upward from its outer edge is fixed to the base top surface with the trough between the concentric rings connected to the vacuum channels. The vacuum trough holds the wafer securely to the chuck and minimizes vibrations when the wafer is rotated.
Claims18
A ring chuck adapted to hold a wafer with a vacuum comprising:
- a base having a top surface equal to or slightly smaller than said wafer, a body of said base having vacuum channels therethrough, said base adapted to be mounted to an instrument;
- a layer of non-contaminant material centered on said top surface;
- and
- a plurality of concentric rings extending upward from said layer forming troughs between said rings, said vacuum introduced into said troughs.
Dependencies are inferred from the claim text.