Pattern forming method
AssigneeNEC Electronics Corporation
InventorMasashi Fujimoto
Life of this patent
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Abstract
A pattern forming method of the invention for transferring a pattern on a photo-mask onto a photo-sensitive resin film on a substrate using a scan-projection exposure method includes the steps of: scanning the photo-mask and the substrate in synchronization with each other; and exposing the photo-sensitive resin film as consecutively correcting an aberration which occurs in a projection optical system which is positioned between the photo-mask and the substrate while scanning the photo-mask.
Claims11
A pattern forming method for transferring a pattern on a photo-mask onto a photo-sensitive resin film on a substrate using a projection exposure method, the pattern forming method comprising the steps of:
- correcting an aberration using correcting means for correcting an aberration which occurs in a projection optical system which is positioned between the photo-mask and the substrate and interposed between the photo-mask and the projection optical system;
- and
- forming an image of the pattern on the photo-mask onto the photo-sensitive resin film.
A pattern forming method for transferring a pattern on a photo-mask onto a photo-sensitive resin film on a substrate using a scan-projection exposure method, the pattern forming method comprising the steps of:
- scanning the photo-mask and the substrate in synchronization with each other;
- and
- exposing the photo-sensitive resin film as consecutively correcting an aberration which occurs in a projection optical system which is positioned between the photo-mask and the substrate while scanning the photo-mask.
Dependencies are inferred from the claim text.