Wiring line for high frequency
AssigneeNEC Electronics Corporation
InventorsRyota Yamamoto, Masayuki Furumiya
Life of this patent
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Abstract
Wiring lines for use at a high frequency having reduced resistance and/or inductance are disclosed that may be readily manufactured in a semiconductor integrated circuit. Wiring lines can include extension lines (2), connected to both ends of an inductor (1), that may each include divided wiring lines (2a and 2b) that are separated by a slit (3). A length, width and thickness of divided wiring lines (2a and 2b) can be essentially equal, resulting in divided wiring lines (2a and 2b) of essentially equal longitudinal resistance. A width of a slit (3) may preferably be greater than a width of each of divided wiring lines (2a and 2b).
Claims20
A wiring line for a semiconductor integrated circuit for high frequency operation, comprising:
- a single wiring line that includes a plurality of divided wiring lines disposed essentially parallel to one another, the single wiring line receiving a high frequency signal with a current that dividedly flows through the plurality of divided wiring lines.
A high frequency wiring for a semiconductor integrated circuit, comprising:
- at least a first wiring for connecting a signal between two points that includes a plurality of divided wiring lines, essentially parallel to one another and separated from one another by at least one slit.
A method of reducing a high frequency parasitic inductance of a wiring line between two points on a semiconductor integrated circuit, comprising the steps of:
- dividing at least a portion of the wiring line into a plurality of essentially parallel divided wiring lines separated from one another by at least one slit in which at least a portion of a parasitic inductance of one divided wiring line cancels at least a portion of a parasitic inductance of an adjacent divided wiring line.
Dependencies are inferred from the claim text.