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US 2003/0141571 A1Published application
Semiconductor device and manufacturing method thereof
OwnerMasaaki Itohinventor
Life of this patent
Estimating the term…
Abstract
A recess is formed in a semiconductor substrate and a contact hole is formed in a bottom region of the recess. Circuit elements on a main surface of the semiconductor substrate are connected to conductive elements on an opposite surface of the substrate through the contact hole in the recess.
Claims20
A semiconductor device comprising:
- a semiconductor substrate which includes a first surface and a second surface opposite to the first surface, wherein the first surface includes a recess which has a bottom region;
- a circuit element which is formed in at least the recess on the first surface;
- a conductive element which is formed on the second surface;
- a conductive line which is connected to the circuit element;
- and
- a contact hole which is formed in the bottom region of the recess and connects the conductive line with the conductive element.
3 more elements
A method for fabricating a semiconductor device comprising:
- providing a semiconductor substrate having a first surface and a second surface, wherein the first surface is opposite to the second surface;
- forming a first recess in the first surface, wherein the first recess has a bottom region;
- forming a circuit element on the first surface;
- forming a conductive element on the second surface;
- forming a conductive layer connected to the circuit element;
- and
- forming a contact hole in the bottom region of the recess, wherein the conductive line is connected with the conductive element via the contact hole.
4 more elements
A semiconductor device comprising:
- a semiconductor substrate including a main surface and a opposite surface opposite to the main surface, wherein the semiconductor substrate has a recess;
- a first conductive element which is formed on the main surface;
- a second conductive element which is formed on the opposite surface;
- and
- a connecting element which electrically connects the first conductive element with the second conductive element, wherein the connecting element is formed in the recess and penetrates through the semiconductor substrate.
2 more elements
Dependencies are inferred from the claim text.