Semiconductor device and manufacturing method thereof
AssigneeFujitsu Limited
InventorsMotonobu Sato, Hiroshi Nakadai, Toyoji Sawada, Satoshi Otsuka, Masayuki Nakada
Life of this patent
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Abstract
A redundant fuse is provided with a redundant length, here a winding structure, at one end thereof, here at a vicinity of a second wire side to which a high voltage (Vcc) is impressed. A disconnected portion is provided between the other end side of the redundant fuse, here a second wire side which is on the ground potential (GND) and the winding structure.
Claims24
A semiconductor device, comprising:
- a wire structure including a wire and a fuse,
- wherein said fuse has a redundant length.
A semiconductor device, comprising:
- a wire structure having a wire containing at least copper and a fuse,
- wherein said fuse is formed of a corrosion resistant material.
A manufacturing method of a semiconductor device, comprising the steps of:
- forming a wire in a shape;
- and
- forming a fuse with a portion between a disconnected portion and a high voltage impressed side being a winding structure.
A manufacturing method of a semiconductor device, comprising the steps of:
- forming a wire in a shape;
- and
- forming a fuse with a portion between a disconnected portion and a high, voltage impressed side being a wide structure and/or a thick film structure.
A manufacturing method of a semiconductor device, comprising the steps of:
- forming a wire containing at least copper in a shape;
- and
- forming a fuse made of a corrosion resistant material.
A method for disconnecting a fuse,
- wherein a wire structure including a wire and a fuse is provided,
- wherein the fuse has one end thereof being a high voltage impressed portion, and a winding structure is formed at a vicinity of the high voltage impressed portion, and
- wherein the fuse is disconnected between the other end thereof and the winding structure.
A method for disconnecting a fuse,
- wherein a wire structure including a wire and a fuse is provided,
- wherein the fuse has one end thereof being a high voltage impressed portion, and a wide and/or a thick film structure are/is formed at a vicinity of the high voltage impressed portion, and
- wherein the fuse is disconnected between the other end thereof and the wide and/or the thick film structure.
A method for disconnecting a fuse,
- wherein a wire structure including a wire containing copper and a fuse is provided,
- wherein the fuse is formed of a corrosion, resistant material and one end thereof is to be a high voltage impressed portion, and
- wherein the fuse is disconnected at a vicinity of the other end thereof.
Dependencies are inferred from the claim text.