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US 2003/0141488 A1Published application
Conductive via composition
AssigneeCTS Corporation
InventorTerry R. Bloom
Life of this patent
Estimating the term…
Abstract
A conductive composition for filling a via. The composition is based on total composition and has 4.0-12.0 wt. % organic vehicle and 88.0-96.0 wt. % electrically conductive particles selected from the group consisting of silver and nickel and mixtures thereof.
Claims20
A conductive composition for filling a via, based on total composition comprising:
- a) 4.0-12.0 wt. % organic vehicle;
- and
- b) 88.0-96.0 wt. % electrically conductive particles selected from the group consisting of silver and nickel and mixtures thereof.
A conductive via fill composition, based on total composition comprising:
- a) 4.0-12.0 wt. % organic vehicle;
- and
- b) 15.0-60.0 wt. % silver particles;
- and
- c) 70.0-78.0 wt. % nickel particles.
2 more elements
Dependencies are inferred from the claim text.