Heat dissipating device for an electronic component

A heat dissipating device comprising:

• a lower heat sink unit including a horizontally extending lower base and a plurality of spaced apart lower fins fixed to and extending upwardly from said lower base, each of said lower fins having a top end distal from said lower base;
• and
• an upper heat sink unit stacked above said lower heat sink unit and including a horizontally extending upper base that is fixed to said top ends of at least some of said lower fins, and a plurality of spaced apart upper fins fixed to and extending uprightly from said upper base;
• wherein said lower fins include a set of parallel first lower fins and a set of second lower fins that are parallel to said first lower fins, each of said first lower fins having a horizontal cross-section greater than that of each of said second lower fins, each two adjacent ones of said first lower fins confining a horizontal spacing greater than that of each two adjacent ones of said second lower fins.