Substrate treating method and substrate treating apparatus
AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsHiroaki Sugimoto, Takeshi Yoshida, Hiroshi Kato, Takuya Kuroda, Tadashi Sasaki
Life of this patent
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Abstract
In a substrate treating unit, a removal liquid supplying mechanism supplies a removal liquid to the surface of a substrate. In order to retain the removal liquid on the surface of the substrate for a fixed time, a spin chuck is operated to spin the substrate at such a low speed as to retain the removal liquid on the substrate, or spins the substrate intermittently, or temporarily stops spinning of the substrate. Thus, treatment with the removal liquid progresses without a further supply of the removal liquid, thereby restraining consumption of the removal liquid.
Claims25
A substrate treating method for removing, by using a removal liquid, a reaction product from a surface of a substrate having a film formed on the surface and patterned by dry etching with a resist film acting as a mask, said method comprising:
- a removal liquid supplying step for supplying the removal liquid to the surface of the substrate while spinning the substrate;
- and
- a removal liquid retaining step for retaining the removal liquid on the surface of the substrate for a fixed time.
A substrate treating method for removing an organic substance from a substrate by using a removal liquid, said method comprising:
- a removal liquid supplying step for supplying the removal liquid to a surface of the substrate;
- and
- a removal liquid retaining step for retaining the removal liquid on the surface of the substrate for a fixed time.
A substrate treating apparatus for removing an organic substance from a substrate by using a removal liquid, said apparatus comprising:
- a spin chuck for supporting and spinning the substrate;
- and
- a removal liquid supplying mechanism for supplying the removal liquid to a surface of the substrate supported by the spin chuck;
- wherein said spin chuck is operable, after the removal liquid supplying mechanism supplies the removal liquid to the surface of the substrate, in one of modes for spinning the substrate at such a low speed as to retain the removal liquid on the substrate, for spinning the substrate intermittently, and for temporarily stopping spinning of the substrate.
Dependencies are inferred from the claim text.